Optimization Of Thermal Performance Of The Three-Dimensional Integrated Circuits (3D Ics) Utilizing The Rectangular-Shaped And Disk-Shaped Heat Pipes And Integrated Chip-Size Double-Layer And Multi-Layer Microchannels
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Optimization Of Thermal Performance Of The Three-Dimensional Integrated Circuits (3D Ics) Utilizing The Rectangular-Shaped And Disk-Shaped Heat Pipes And Integrated Chip-Size Double-Layer And Multi-Layer Microchannels